This heat sink compound is a silicone based grease material specially blended with thermally conductive, fine metal oxide powders. It adheres to metal surfaces and will not melt, bleed or harden over time.
This heat sink compound has a wide temperature range, is thermally stable, has a high dielectric strength and will not react with rubber or plastic. It is used as an interface to facilitate the transfer of heat from electronic or electrical devices to the heat sink or chassis. This compound will extend the life of heat sensitive electronic or electrical parts.
A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal "bridge" to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).
|Manufacturer Part No.||HSC67-6G|
|Specific Gravity||2.1 @ 25°C|
|Shelf Life||60 months|
USE INSTRUCTIONS: Use a thin coat of heat sink compound between the heat sink and semiconductor to enhance heat transfer. For best results, the heat sink and semiconductor should have a tight mechanical bond.
CAUTION: Keep out of reach of children. Flush with water in case of contact with eyes or skin. May be harmful if swallowed. Contains Polysiloxane and Zinc Oxide. For medical emergencies call (303) 623-5716.