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Kester 186, under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, the flux residue, after soldering, is non-corrosive and non-conductive. Kester 186 rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications.
Moisture and fungus resistant
High thermal stability
Improves soldering performance
Eliminates the need and expense of cleaning
Classified as ROL0 per J-STD-004
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