• Model: NTE425
  • Catalog #: 55052030

NTE425 Self-adhesive Thermal Interface Pad (1.65"x1.65")

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$3.67

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(Online Only)

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Additional Information

  • Summary
  • Reviews
The NTE425 is designed as a pressure-sensitive, thermal interface material for use between a high-performance processor and a heat sink. It is a thermally conductive, inherently tacky, 55°C phase change composite supplied on a polyester carrier liner with high-visibility protective tabs. Typical applications include computer and peripherals, high-performance computer processors, graphic cords, and power modules.
  • Thermal impedance: 0.08°C−in²/W at 25psi
  • Color: black
  • Reinforcement carrier: none
  • Thickness: 0.077mm
  • Continuous use temperature: 120°C
  • Phase change temperature: 55°C
  • Flame rating: UL 94 V-0
  • Thermal conductivity: 0.7W/m-K
Pricing and availability: Please note that all prices are subject to change without prior notice. Prices advertised on this site are for online orders only. Prices on some items may differ from those advertised in RadioShack stores. All merchandise may not be available at all stores, and all stores may not participate in all sales promotions. We recommend you contact the store to confirm product availability and price.

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Summary

The NTE425 is designed as a pressure-sensitive, thermal interface material for use between a high-performance processor and a heat sink. It is a thermally conductive, inherently tacky, 55°C phase change composite supplied on a polyester carrier liner with high-visibility protective tabs. Typical applications include computer and peripherals, high-performance computer processors, graphic cords, and power modules.
  • Thermal impedance: 0.08°C−in²/W at 25psi
  • Color: black
  • Reinforcement carrier: none
  • Thickness: 0.077mm
  • Continuous use temperature: 120°C
  • Phase change temperature: 55°C
  • Flame rating: UL 94 V-0
  • Thermal conductivity: 0.7W/m-K

Supporting Documents

Tech Specs

The NTE425 is designed as a pressure-sensitive, thermal interface material for use between a high-performance processor and a heat sink. It is a thermally conductive, inherently tacky, 55°C phase change composite supplied on a polyester carrier liner with high-visibility protective tabs. Typical applications include computer and peripherals, high-performance computer processors, graphic cords, and power modules.

Reviews